From bikes to Teslas to fire trucks to mom, Kyle Long JerseysNFL players rolled through the first week of training camp with fun, speed and power.

Antonio Brown always makes a grand entrance, Alshon Jeffery Jerseysand he didn't disappoint this year as he once again arrived in a Rolls Royce. But this one had a classic twist.Indianapolis Colts cornerback Vontae Davis had a slightly faster mode of transportation in his Slingshot.

Colts CB Vontae Davis arrives to training camp in a Slingshot in honor of former Colt Reggie Wayne, Walter Payton Jerseyswho often arrived to training camp in styleThe Carolina Panthers displayed an eclectic variety of wheels.

There was the three-wheeler used by Cam Newton ...

Panthers quarterback Cam Newton stops on his three-wheeler to pose for a picture and sign an autograph after practice. Danny Trevathan Jerseysand the "Duck Car" driven by former Oregon star Jonathan Stewart.

Panthers running back Jonathan Stewart called this his "Duck" car when he arrived at training camp. The former Oregon star meant it. Notice all the detail "Duck" detail.DeSean Jackson bonded with his new Tampa Bay Buccaneers teammate when he made an airport pick-up of Mike Evans in this slick ride.

How's the chemistry going with Mike Evans and DeSean Jackson? Kevin White JerseysJackson picked Evans up at the airport this morning and they rolled up to camp in Jackson's Ferrari. (Photo courtesy of the Buccaneers)

Thermal Management

Distributor for MG and Thermashield, E-RIDE offers thermally conductive materials available in-stock. Epoxy, Adhesives and Silicone.

  • Fans
  • Heatsinks
  • Thermally Conductive Materials
  • Adhesives


Fans:

* Sizes from 25mm to 120mm
* 5V, 12V, 24V and 48V DC input voltages
* Various speed options
* UL, CSA, CE and TUV approved
* Options for thermal control, tachometer output, and restart
* Industry standard connectors available

Heatsinks: Board Level Stamped Heat Sinks, Extruded Heat Sink, Stamped Heat Sinks, Bonded and Folded Fin Heat Sinks.

We offer heat sinks and fan/heat sink assemblies to cool processors up to 2.0 GHz including Pentium III and 4, and AMD Athlon up to 1.5 GHz. Socketed processors, Xeon, Flip-chip, and BGA cooling devices.

Stamped Heat Sinks in aluminum or solderable tabs; small extruded heat sinks with preinserted solderable pins, and including interface pads.

Bonded, folded fin, and extruded heat sinks in extensive variety of standard and custom configurations.

Thermal Management: High performance thermal interface materials available from recognized suppliers including Bergquist, Chomerics, Power Devices, and Warth; thermal resistance from 0.07 to 0.5 °C/W; available with or without adhesive; thermally conductive adhesives in one- or two-part systems.

BGA and QFP integrated heat spreaders; wide assortment of retention and attachments in both standard and custom configurations.

Adhesives: Silver Conductive Epoxy, Fast Set Epoxy, Super Cyanoacrylate Adhesive, Thermally Conductive RTV Silicone, Projection Tube Coolant, Thermally Conductive Epoxy, Carbon Conductive Grease and Silicone Heat Transfer.
 

For a Catalogue, Samples or Technical Support:
E-mail: sales@eride-electronics.com
Phone: (760) 323-5875 | Fax: (760) 323-5876
Toll Free: (866) 345-5950
E-Ride Enterprises, Inc.